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High - Thermal APG Epoxy for CTs - Low Shrinkage, Moisture Resistant

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High - Thermal APG Epoxy for CTs - Low Shrinkage, Moisture Resistant

Brand Name : wenyou

Model Number : 9202

Certification : ISO9001, ISO14001, SGS, and UL

Place of Origin : China

MOQ : 20kg/pail as sample

Price : Negotiable

Payment Terms : Normally T/T, L/C

Supply Ability : Plenty of raw material in stock

Delivery Time : 7 -10 work days

Packaging Details : 20kg/pail, 220kg/barrel, 1200kg/tank

Classification : Double Components Adhesives

Usage : insulators, dry-type transformers, and other insulation products.

Application : Indoor electrical insulators for medium and high voltage applications

Epoxy vlue : 4.5 - 5.0Eq/kg

Viscosity at 25°C : 7000 - 10000mPa.s

Density at 25°C : 1.16 - 1.20g/cm3

Vapor Pressure at 25°C : < 0.01Pa

Flash point : around 130°C

Discription : High - Thermal APG Epoxy for CTs - Low Shrinkage, Moisture Resistant

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Brief Introduction

LE-9205 is a liquid solvent-free saturated cyclic epoxy resin.

LH-9205 is a liquid modified carboxylic anhydride hardener with an added accelerator.

LF-660 is a low-viscosity solvent-free modified polyol.

LZ-630 is a modified tert-butylamine.

 

High - Thermal APG Epoxy for CTs - Low Shrinkage, Moisture Resistant

 

Optimized for heat management, this low-shrinkage APG epoxy features high thermal conductivity to dissipate CT operational heat. Its moisture-resistant design ensures durability in harsh environments, while halogen-free formulation aligns with environmental norms. Perfect for substations, renewables, and high-reliability metering systems.

Applications

Indoor electrical insulators for medium and high voltage applications, such as insulators, dry-type transformers, and other insulation products.

Processing Methods

Conventional gravity casting process under vacuum.

Automatic pressure gelation process (APG).

Production process is adjustable according to client’s present production methods.

Properties

Excellent resistance to thermal shock, superior mechanical and dielectric properties.

 

Formulation

 

Epoxy resin LE-9202 100 pbw
Hardener LH-9202 100 pbw
Flexibilizer LF-660 0-20 pbw
Accelerator LZ-630 0.2-1.0 pbw
Filler Silica powder 350-480 pbw
Color paste LC series* 3 pbw

 

Advantage

 

High - Thermal APG Epoxy for CTs - Low Shrinkage, Moisture Resistant

 

Package Image

 

High - Thermal APG Epoxy for CTs - Low Shrinkage, Moisture Resistant

Shipment image

 

High - Thermal APG Epoxy for CTs - Low Shrinkage, Moisture Resistant

 

Example application image

 

High - Thermal APG Epoxy for CTs - Low Shrinkage, Moisture Resistant

 


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